Technoform Edge Bond Solutions Singapore Pte Ltd – Internship – Process Engineer

Technoform specializes in the extrusion of thermoplastic profiles. This specialization applies particularly to the manufacture and development of insulating profiles for aluminum windows, doors, and facades. 

• Dive deep into understanding our manufacturing workflows and process steps to identify gaps and business challenges for business continuity and improvement planning.
• Benchmark with industry best practices internally within our global networks and externally with industry.
• Collaborating with multi-functional teams to identify issues and resolve issues.
• Develop and lead process improvement implementation plan.

• Working with the technical team in developing and leading process improvement implementation plan.

• Pursuing a Bachelors degree in Engineering or Science with an expected graduation date of December 2021 or later.
• Looking for a minimum of 3 months internship
• Ability to learn quickly in a rapidly changing environment
• Excellent organizational, analytical skills and attention to detail
• Superb communication skills