Technoform Edge Bond Solutions Singapore Pte Ltd – Management Associate Intern

Technoform is the market leader in multiple industries with innovative and market-oriented solutions. In the building industry, we are a highly specialized and trusted partner to our stakeholders for more than 40 years. Our core solutions of high-precision thermal insulation profiles and edge bond technology help optimise thermal performance of the building envelope and considerably reduce carbon emissions.

Worldwide, we are present with more than 45 sales offices and over 1500 employees. Our global team of passionate people connect with like-minded and forward looking organizations, and together, we make the world better and more sustainable, one building façade at a time.

Responsibilities

• Exposure to the different business functions such as logistics, quality, marketing, digitalization and business development.
• Explore, identify and implement improvement projects in different business functions to bring value add.
• Work on digitalization projects across different business units to drive for better efficiency.

Requirements

• Pursuing a Bachelors degree in Engineering or Science with an expected graduation date of May 2023 or later.
• Looking for a minimum of 3 months internship
• Ability to learn quickly in a rapidly changing environment
• Excellent organizational, analytical skills and attention to detail
• Superb communication skills